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  Új Válasz 2021-11-08 17:50:37 #5921

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  AT: AMD Gives Details on EPYC Zen4: Genoa and Bergamo, up to 96 and 128 Cores
  
  AMD has stated to us in our briefing that Genoa and Bergamo will be socket compatible, with Genoa coming in the 2022 timeframe, while Bergamo in late 2022/early 2023 (with a focus more on the early 2023 target). When asked, AMD did not want to narrow down the Genoa timeframe in a similar light. Bergamo however will have the same features as Genoa: DDR5, PCIe 5.0, CXL 1.1, RAS, and AMD's security suite.

  The use of two different core optimization points is going to be an interesting one for AMD. Normally it creates one core chiplet design that can be used across consumer and server processors, but the development of a Zen 4c chiplet now means the company has to manage stock of both independently. Also, both being on 5nm means that the mask development costs are likely to be double than a singular design across all. AMD did not disclose any new details about a centralized IO die – what is on it, or where it was made.

  The Zen 4c chiplet, according to AMD, is built on an HPC variant of TSMC N5. This aims at denser logic and denser cache, likely at the expense of high-end frequency. AMD says that this process offers 2x density, 2x power efficiency, and >1.25x silicon performance over the regular N7 it uses. When asked if this was a specific statement about core performance, AMD said that it wasn’t, and just a comment on the process node technologies. It is worth noting that 2x efficiency is quite a substantial claim based on metrics provided by TSMC on its N7 -> N5 disclosures.
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